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This page brings together detailed packaging information, for both discrete
and IC packages.
It includes:
a package tree, enabling you to explore our total packaging offer
quickly. Click on any branch to expand further sub-branches
a dedicated packaging search engine, which accepts partial package names
a search for packages using the Philips marking code.
Having identified a package, a table will be presented with package
version, package name, package description, reference codes and issue date.
Clicking on the package will take you to a Package Information Page with an
outline drawing, soldering information, handling precautions and thermal
considerations.
To find a package you can browse the package tree. 
Ceramic (75)
Glass (16)
Metal (1)
Plastic (691)
 
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| # | Package version | Package name | Package description | Reference codes | Issue date |
|---|
| 1 |
SOD27-1 |
SOD27 |
Hermetically sealed glass package; axial leaded; 2 leads |
SC-40 (JEITA) DO-35 (JEDEC) A24 (IEC) |
2005-12-22 |
| 2 |
SOT1000-1 |
HVQFN36R |
plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm |
--- (JEITA) --- (JEDEC) |
2008-3-14 |
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